Small module technology
Resin package technology
Our resin package module adopts the vacuum printing method.
Since it does not use expensive molds, it reduces development costs and is suitable for small-lot, high-mix production. By printing in a vacuum environment, we have achieved highly reliable packaging without air bubbles inside the resin. We can also provide modules with a conductive resin shield after resin encapsulation.
Since it does not use expensive molds, it reduces development costs and is suitable for small-lot, high-mix production. By printing in a vacuum environment, we have achieved highly reliable packaging without air bubbles inside the resin. We can also provide modules with a conductive resin shield after resin encapsulation.
Printing in a vacuum environment
Microcomputer module
5.1×5.1mm
- Resin package
Battery module with charging circuit
9.9×7.9mm
- Resin package
COMBO module (WLAN, BT, FM)
9.5×6.1mm
- Resin + shield package
| Method | Transfer mold | Compression mold | Print in a vacuum |
|---|---|---|---|
| Mold cost | △ use |
△ use |
〇 no use |
| Mass production | 〇 | 〇 | △ |
| Degree of air bubbles | 〇 | 〇 | ◎ |