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Small module technology

Resin package technology

Our resin package module adopts the vacuum printing method.
Since it does not use expensive molds, it reduces development costs and is suitable for small-lot, high-mix production. By printing in a vacuum environment, we have achieved highly reliable packaging without air bubbles inside the resin. We can also provide modules with a conductive resin shield after resin encapsulation.

Printing in a vacuum environment

Microcomputer module

  • Resin package

Battery module with charging circuit

  • Resin package

COMBO module (WLAN, BT, FM)

  • Resin + shield package

Method Transfer mold Compression mold Print in a vacuum
Mold cost


no use
Mass production
Degree of air bubbles