Bluetooth® Low Energy Module

BLE Modules

Features

  • Ultra-small module with slot antenna built into shielded package.
  • Best match for small products with restricted PCB-area.
  • Just fit for highly creative or unique products based on the wiring design flexibility.

Specifications

Model NameHY0020HY0021
Under Developement
Bluetooth versionv5.4v5.4
Built-in Bluetooth ICNordic nRF52832Nordic nRF52805
CPUArm® Cortex®–M4 with FPUArm Cortex–M4
Memory512KB Flash / 64KB RAM192KB Flash / 24KB RAM
Number of GPIOs16
(NFC, SPI, I2C, I2S, UART, PDM, QDEC, ADC)
8
(SPI, I2C, UART, QDEC, ADC)
High-speed clock (32MHz)Built-inBuilt-in
Low-speed clock (32.768kHz)Built-inBuilt-in
Operating Temperature range (°C)-40 to +85-40 to +85
Operating voltage range (V)1.7 to 3.61.7 to 3.6
Dimension (mm)3.5 x 10 x 13.5 x 10 x 1
Package29-Pin LGA24-Pin LGA
Certification/qualificationJapan (MIC)
U.S.A. (FCC)
Canada (ISED)
(ETSI EN300 328 V2.2.2)
Bluetooth
Japan (MIC)
U.S.A. (FCC)
Canada (ISED)
(ETSI EN300 328 V2.2.2)
Bluetooth
  • FDK Corporation designs, manufactures and sells these modules under license of Slot Antenna on Shielded Package technology patented by Toshiba Corporation.
  • The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
  • Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.