Bluetooth® Low Energy Module
Features
- Ultra-small module with slot antenna built into shielded package.
- Best match for small products with restricted PCB-area.
- Just fit for highly creative or unique products based on the wiring design flexibility.
Specifications
Model Name | HY0020 | HY0021 Under Developement |
---|---|---|
Bluetooth version | v5.4 | v5.4 |
Built-in Bluetooth IC | Nordic nRF52832 | Nordic nRF52805 |
CPU | Arm® Cortex®–M4 with FPU | Arm Cortex–M4 |
Memory | 512KB Flash / 64KB RAM | 192KB Flash / 24KB RAM |
Number of GPIOs | 16 (NFC, SPI, I2C, I2S, UART, PDM, QDEC, ADC) | 8 (SPI, I2C, UART, QDEC, ADC) |
High-speed clock (32MHz) | Built-in | Built-in |
Low-speed clock (32.768kHz) | Built-in | Built-in |
Operating Temperature range (°C) | -40 to +85 | -40 to +85 |
Operating voltage range (V) | 1.7 to 3.6 | 1.7 to 3.6 |
Dimension (mm) | 3.5 x 10 x 1 | 3.5 x 10 x 1 |
Package | 29-Pin LGA | 24-Pin LGA |
Certification/qualification | Japan (MIC) U.S.A. (FCC) Canada (ISED) (ETSI EN300 328 V2.2.2) Bluetooth | Japan (MIC) U.S.A. (FCC) Canada (ISED) (ETSI EN300 328 V2.2.2) Bluetooth |
- FDK Corporation designs, manufactures and sells these modules under license of Slot Antenna on Shielded Package technology patented by Toshiba Corporation.
- The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc.
- Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.