EMS/ODM, Custom Modules

We drive product development and commercialization through advanced circuit design, CAD, implementation, and evaluation technologies. Focusing on miniaturization, wireless communication, and sensing, we develop innovative applied products tailored to emerging needs. From the design stage, we deliver high-density, high-quality, and high-value-added modules and solutions, based on a technology-driven approach to design and development.

Compact Resin Package Modules

Compact Resin Package Modules

Control System Modules
Control System Modules
Drive System Modules
Drive System Modules
Custom DC/DC Converters
Custom DC/DC Converters

Features

  • Various ultra-compact modules
    • High-density mounting (0.3 mm pitch CSP, 0402 chip components).
    • Contributes to downsizing of the main board through ultra-compact modularization.
    • Functional integration, standardization, and SMD compatibility through modularization, contributing to differentiated competitive advantage.
    • Supports resin encapsulation and shielded packaging.
    • Optimized PCB design with high-density buildup substrate.
  • For automotive applications and other modules (various EMS and ODM products)
    • High-density double-sided mounting (BGA packages, CSP packages, chip components).
    • Implementation of ultra-compact modular products.
    • Component mounting on PCBs and FPCs.
    • Optimized board specification design, from through-hole boards to high-density buildup substrates.
    • Certified under IATF 16949.
  • Custom DC/DC Converters
    • We also support high-efficiency designs using high-power planar transformers.