Tokyo, Japan - FDK Corporation (President: Hiroshi Shimozono, hereinafter "FDK") today announced the development of its new ultra-compact Bluetooth® Low Energy (hereinafter "Bluetooth LE") module, HY0025, the third product in its world's smallest-class Bluetooth LE module series, and will begin sample shipments to selected domestic customers in July. Sample shipments for general domestic customers and overseas customers are scheduled to begin in January 2027.
The HY0025, like the existing HY0020 and HY0021, is an ultra-compact Bluetooth LE module incorporating SASP™ technology developed by Toshiba Corporation. SASP technology enables the antenna to be formed on the shielded package on the top surface of the module. This eliminates the need for a large keep-out area around the antenna and achieves one of the smallest board-level occupied areas in the world. This product is an optimal solution for wirelessly transmitting data from a wide range of sensors in physical AI and healthcare applications.
The HY0025 is equipped with Nordic Semiconductor's nRF54L15 SoC compliant with Bluetooth ver.6. In addition to conventional Bluetooth LE communication, it supports long-range communication via Coded PHY and Channel Sounding, which enables highly accurate distance measurement between devices. These advanced features are expected to drive the creation of next-generation applications utilizing location and distance information.
Furthermore, the module integrates an Arm® Cortex®-M33 processor operating at 128 MHz, 1.5 MB of NVM, and 256 KB of RAM, providing ample resources for applications requiring advanced wireless functionality and enhanced security. The HY0025 achieves a maximum output power of +8 dBm and a receiver sensitivity of -96 dBm, and operates over a wide temperature range of -40 °C to +105 °C, making it suitable for harsh environments such as industrial and automotive-related applications.
The HY0025 is pin-compatible with the existing HY0020, allowing easy replacement with minimal redesign. This compatibility enables customers to leverage existing PCB design assets while smoothly upgrading to next-generation Bluetooth LE capabilities.
In addition to Bluetooth LE, the module supports multiple wireless protocols, including Thread®, Matter™, and Zigbee®, allowing flexible deployment across the rapidly expanding IoT and smart infrastructure markets.
Through the HY0025, FDK will continue to deliver high-value wireless solutions that address the increasingly sophisticated and diverse needs of the IoT market, contributing to a society where people and things are seamlessly connected.
Key Features of HY0025
- Bluetooth ver.6 compliant
- High-accuracy distance measurement with Channel Sounding
- Long-range communication with Coded PHY
- Ultra-compact package with integrated antenna enabled by SASP technology
- Pin-compatible design with HY0020
- Multi-protocol support (Bluetooth LE, Thread, Matter, Zigbee)
- Wide operating temperature range: -40°C to +105°C
Typical Applications
Digital keys, smart locks, asset tracking tags, monitoring devices, high-precision ranging and positioning equipment, healthcare devices, and various IoT devices
Main Specifications
| Bluetooth SoC | Nordic Semiconductor nRF54L15 |
|---|---|
| CPU | Arm Cortex-M33 (128 MHz) |
| Memory | 1.5 MB NVM / 256 KB RAM |
| Max output power | +8 dBm |
| Receiver sensitivity | -96 dBm |
| GPIO | 15 I/Os + nRESET |
| High-speed clock | 32 MHz (internal) |
| Low-speed clock | 32.768 kHz (internal) |
| Supply voltage | 1.7 to 3.6 V |
| Operating temperature | -40 °C to +105 °C |
| Dimensions | 3.5 x 10 x 1.3 mm |
| Certifications (planned) | Bluetooth MIC Japan FCC ISED (ETSI EN300 328 V2.2.2) |
- Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., and any use of such marks by FDK Corporation is under license.
- SASP technology is a patented technology of Toshiba Corporation. FDK Corporation has entered into a license agreement with Toshiba Corporation.
- Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
- Thread® is a registered trademark of Thread Group, Inc.
- Matter™ is a trademark of Connectivity Standards Alliance.
- Zigbee® is a registered trademark of Connectivity Standards Alliance.
Contact Information
- For the Press
- Corporate Planning and Finance Dept. TEL：+81-3-5715-7403
- For Customers
- Business Development Dept., Sales Group TEL：+81-3-5715-7407