Bluetooth® Low Energy Module
Model Name : HY0025Under Development
Features
- Ultra-small module with slot antenna built into shielded package
- Large area restrictions are not required. One of the smallest board-level occupied areas in the world.
- Easy for PCB design based on maximum patterning flexibility
- Various certifications have been obtained.
- Channel Sounding enables high-accuracy distance measurement.
Product Profile
- Bluetooth v6.0
◦LE 2M
◦LE Coded
◦Channel Sounding - SoC: Nordic nRF54L15
- CPU: Arm® Cortex®-M33, 128MHz
- Memory: 1.5MB NVM / 256KB RAM
- Integrated 32MHz, 32.768kHz crystal oscillators
- Integrated DC-DC circuit components
Applications
- Wearables
- Health Care
- Remote Control
- IoT
- Beacons
- Computer Peripherals
Specifications
| Bluetooth version | v6.0 |
|---|---|
| Built-in Bluetooth IC | Nordic nRF54L15 |
| CPU | Arm Cortex-M33, 128MHz |
| Memory | 1.5MB NVM / 256KB RAM |
| TX power | +8dBm |
| RX sensitivity | -96dBm (1Mbps) |
| TX current(DC-DC) | 9.8mA(1Mbps, +8dBm) |
| RX current(DC-DC) | 3.4mA(1Mbps) |
| Multi-protocol | 802.15.4, Thread®, Zigbee®, Matter™ |
| GPIO | 15 GPIO + nRESET |
| Interfaces / Peripherals | NFC, SPI, I2C, I2S, UART, PDM, QDEC, PWM, 14-bit ADC |
| High frequency clock | Built-in 32MHz crystal |
| Low frequency clock | Built-in 32.768kHz crystal |
| LC components for DC-DC | Built-in |
| Operating temperature range | -40°C to +105°C |
| Operating voltage range | 1.7V to 3.6V |
| Dimension | 3.5 x 10.0 x 1.3mm |
| Package | 29-Pin LGA |
| Certification/Qualification | Japan (MIC) U.S.A. (FCC)(Planned) Canada (ISED)(Planned) (ETSI EN300 328 V2.2.2)(Planned) Bluetooth(Planned) |
Evaluation boards
Model Name : HY0026-01Evaluation boards of FDK HY0025 is available. The boards may be used to check characteristics of the module and for software development.
Documents
| Document Name | Ver. | Date | Download File |
|---|---|---|---|
| Product Brief | 0.93 | 2026/7/6 | HY0025_ProductBrief_en.pdf |
| Datasheet | - | - | - |
| Application Note | - | - | - |
| HY0025 CAD File | - | - | - |
| EVB Manual | - | - | - |
| Software Development Guide | - | - | - |
- The Bluetooth® word mark is registered trademarks owned by Bluetooth SIG, Inc.
- FDK Corporation designs, manufactures and sells these modules under license of Slot Antenna on Shielded Package technology patented by Toshiba Corporation.
- Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
- Thread® is a registered trademark of Thread Group, Inc.
- Matter™ is a trademark of Connectivity Standards Alliance.
- Zigbee® is a registered trademark of Connectivity Standards Alliance.