Bluetooth® Low Energy Module
Model Name : HY0020
Features
- Ultra-small module with slot antenna built into shielded package
- Large area restrictions are not required. One of the smallest board-level occupied areas in the world.
- Easy for PCB design based on maximum patterning flexibility
- Various certifications have been obtained.
Product Profile
- Bluetooth v5.4
◦LE 2M - SoC: Nordic nRF52832
- CPU: Arm® Cortex®-M4F, 64MHz
- Memory: 512KB Flash / 64KB RAM
- Integrated 32MHz, 32.768kHz crystal oscillators
- Integrated DC-DC circuit components
Applications
- Wearables
- Health Care
- Remote Control
- IoT
- Beacons
- Computer Peripherals
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Specifications
| Bluetooth version | v5.4 |
|---|---|
| Built-in Bluetooth IC | Nordic nRF52832 |
| CPU | Arm Cortex-M4F, 64MHz |
| Memory | 512KB Flash / 64KB RAM |
| TX power | +4dBm |
| RX sensitivity | -94dBm (1Mbps) |
| TX current(DC-DC) | 7.5mA(1Mbps, +4dBm) |
| RX current(DC-DC) | 5.4mA(1Mbps) |
| Multi-protocol | ANT |
| GPIO | 16 GPIO |
| Interfaces / Peripherals | NFC, SPI, I2C, I2S, UART, PDM, QDEC, PWM, 12-bit ADC |
| High frequency clock | Built-in 32MHz crystal |
| Low frequency clock | Built-in 32.768kHz crystal |
| LC components for DC-DC | Built-in |
| Operating temperature range | -40°C to +85°C |
| Operating voltage range | 1.7V to 3.6V |
| Dimension | 3.5 x 10.0 x 1.0mm |
| Package | 29-Pin LGA |
| Certification/Qualification | Japan (MIC) U.S.A. (FCC) Canada (ISED) (ETSI EN300 328 V2.2.2) Bluetooth |
Evaluation boards
Model Name : HY0022Evaluation boards of FDK HY0020 is available. The boards may be used to check characteristics of the module and for software development.
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Documents
| Document Name | Ver. | Date | Download File |
|---|---|---|---|
| Product Brief | 3.5 | 2026/3/11 | HY0020_ProductBrief_en.pdf |
| Datasheet | 2.1 | 2026/3/11 | HY0020_Datasheet_en.pdf |
| Application Note | 1.0 | 2024/4/19 | HY0020_AppNote_en.pdf |
| HY0020 CAD File | 1.0 | 2025/1/8 | HY0020_CAD_Files.zip |
| EVB Manual | 2.0 | 2024/12/5 | HY0020_EVBmanual_en.pdf |
| Software Development Guide | 1.0 | 2024/12/13 | HY0022_Software_Development_Guide_en.pdf |
- The Bluetooth® word mark is registered trademarks owned by Bluetooth SIG, Inc.
- FDK Corporation designs, manufactures and sells these modules under license of Slot Antenna on Shielded Package technology patented by Toshiba Corporation.
- Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.