 |
||||||||||||||||||||||||||||||||||||||||
| FDK Developed High Performance "Multilayer Chip Baluns" - Realized the world's smallest class-size ! - | ||||||||||||||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||||||||||||
| Sep. 17, 2004 FDK CORPORATION |
||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||
| FDK CORPORATION developed the world's smallest*1 multilayer chip baluns "AMB1608C series" used for short-range wireless communications such as BluetoothTM*2 and wireless LAN. FDK has also achieved 30% lower*3 insertion loss than the conventional products in this series. The short-range wireless communications such as BluetoothTM and wireless LAN are currently used for PCs and peripherals and it is expected to be broader use such as cellular phones and PDAs in the near future. Especially, it is expected to add this communication function for a cellular phone to enhance its convenience greatly. For instance, it can be used for the exchange of mail addresses between cellular phones without going through a base station, the payment of shopping in convenience stores and to vending machines and the hands-free devices of cars. In reply to the above needs, FDK had tackled the development of baluns which are essential to the short range wireless communications on impedance matching between balanced and unbalanced circuits. "AMB1608C series" baluns have realized the highest class performance of low insertion losses of 0.7dB and lead free solder as well as 0.6mm of thinness required in RF circuit of a cellular phone. It has been contributed by the development of the LTCC materials used for the main part of the products and the optimization of laminating patterns in addition to use FDK's fine-ceramics material technology, thin layer process technology and CAE technology as well. FDK will start sample distribution in October, 2004 to PDA and car navigation markets as well as the rapidly expanding 3G cellular phone market. New baluns will be exhibited at CEATEC JAPAN 2004 in Makuhari Messe on October 5-9, 2004. (notes) *1: Researched by FDK as of Sep. 17, 2004. *2: Bluetooth is a registered trademark of Bluetooth SIG, Inc. *3: Comparison to the conventional products of FDK. [Specification]
|
||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||
| [Close] | ||||||||||||||||||||||||||||||||||||||||
|
|
||||||||||||||||||||||||||||||||||||||||
| Terms of Use | Privacy Policy | ||||||||||||||||||||||||||||||||||||||||
 |
||||||||||||||||||||||||||||||||||||||||
