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Multilayer Chip Baluns-Realized the world's smallest class-size! *1
"AMB 1608C series" are High Performance Multilayer Chip Baluns
developed by FDK's original material technology, simulation technology,
and high frequency technology. Its small size, high efficiency, and low
consumption of power would be perfect match for mobile communication equipment.
"AMB1608C series" realized the highest-class performance of low
insertion losses of 0.7dB and lead free solder as well as 0.6mm of thinness
required in RF circuit of a cellular phone.
*1:Researched by FDK as of Sept.17,2004.
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